Our surface mount lines are powered by Universal Fuzion Platform and MyDATA Automation. They are capable of production throughput from prototype and low NPI well into medium volumes. We can perform single and double sided component placements on rigid, flex or rigid flex boards and support a mixture of SMT and manual component assemblies.
Our SMT lines are tuned for flexibility and backed by a large cartridge inventory with the capability to place small parts (down to 01005) and larger packages (3” x 3”) with extreme accuracy.
AMTI Advanced Manufacturing capabilities include solutions for products that exclusively use through-hole components, as well as assemblies that utilize both surface mount and through-hole components.
For surface mount assemblies also utilizing through-hole components, AMTI has both the experience and proven processes to ensure astounding quality with the through-put necessary to get your product delivered on time and on budget.
AMTI has extensive experience with Ball Grid Arrays (BGAs), micro BGAs, QFNs, QFPs, Micro Leadframe packages (MLP), LGAs, Flip Chips, and bottom terminating SMT components. Our Surface Mount capabilities include placements as small as 0201 components and packages as large as 3”x3”.
Our SMA process engineers have direct experience supporting and producing package on package assemblies, and support Rigid, Flex, and Rigid Flex circuit board substrates.
We have the capability to provide customized automated and manual functional test service solutions powered by AMTI technicians trained in an array of testing methods and procedures based on your specific product and need. In addition to functional test options AMTI also utilizes optical and x-ray inspection equipment to ensure peak performance and durability.
AMTI uses various inspection technologies driven by a strong quality and inspection tracking system that ensures (live and real-time) that PCB assemblies meet and exceed customer's defined quality standards.
We bookend our inspection process by using: Solder Paste Inspection (SPI) for mitigation of solder paste deposit issues, Automated Optical Inspection (AOI) of PCB assemblies to inspect placement accuracy, and X-ray technology to inspect solder quality - catching voids and bridges. Computer controlled repair stations enable us to repair, remove and replace BGAs or QFPs should they not meet quality standards.
Conformal coating or potting can be essential for enhancing the reliability and long-term performance of your mission critical electronic assemblies. It can provide protection against fungus, moisture, corrosion, thermal and mechanical shock.
For your ruggedized product manufacturing needs, AMTI provides dedicated factory space with conformal coating and potting options that allow you to extend your product into a broader range of application environments:
We have the ability to provide serialized product tracking, test tracking by serial number, and lot code tracking. We also have the direct experience, proven documented processes, and the software routing systems needed to be effective.